We've received your request for DH75681 226 (described as Microcircuit Memory), manufactured by Advanced Micro Devices Inc with CAGE code 34335. This part is registered under NSN 5962-01-089-1037, classified in FSG 59 Electrical and Electronic Equipment Components / FSC 5962 Microcircuits Electronic. Our verification process will confirm traceability through supporting identifiers including NIIN 01-089-1037, NCB code 01 (origin: USA), and INC 41015. Please submit your formal quotation request to proceed.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-089-1037 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 010891037 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | G | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 18330 | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 910.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | GOLD |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 82577-932820 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
|---|---|
| ESD | B - Represents items with esd sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | G - Item contains gold. |
| AAC | Z |
|---|---|
| Classification Control | U |
| MGMT_CTL | Sf9eh-v |
| Quantity per pack | 1 |
| Repariability | |
| Shelf Life | N/A |
| SOS | Sms |
| Unit of Measure | Ea |
| ACC: | H - Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps) |
|---|---|
| ADC: | A - Shipment is not a consolidation and does not exceed 84 inches in any dimension. |
| LCL: | P - 77.5 |
| LTL: | W - Rating variable |
| NMFC: | 061700 - Elec appliances/instruments noi |
| SHC: | 9 - Other or no special handling required (sh) |
| TCC: | Z - No special type of cargo code applicable |
| WCC: | 738 - Computing equipment, computer components, and circuit cards |
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