We've received your request for KHX1600C9D3K2 8GX (described as Microcircuit Memory), manufactured by Kingston Technology Company Inc with CAGE code 0P2J5. This part is registered under NSN 5962-01-606-1202, classified in FSG 59 Electrical and Electronic Equipment Components / FSC 5962 Microcircuits Electronic. Our verification process will confirm traceability through supporting identifiers including NIIN 01-606-1202, NCB code 01 (origin: USA), and INC 41015. Please submit your formal quotation request to proceed.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-606-1202 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 016061202 | N | A | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| A | G | 0 | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| KHX1600C9D3K2/8GX | 5 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 133.35 MILLIMETERS NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.410 WATTS |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MEMORY MODULE |
| FEAT | SPECIAL FEATURES | 8GB (4GB 512M X 64-BIT X 2PCS) |
| PRMT | PRECIOUS MATERIAL | GOLD |
| SPCL | SPECIAL TEST FEATURES | ASYNCHRONOUS RESET |
| CBBL | FEATURES PROVIDED | BIDIRECTIONAL |
| ADAU | BODY HEIGHT | 30.0 MILLIMETERS NOMINAL |
| AFGA | OPERATING TEMP RANGE | +1.0 TO 85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0 TO 100.0 DEG CELSIUS |
| CWSG | TERMINAL SURFACE TREATMENT | GOLD |
| CZEQ | TIME RATING PER CHACTERISTIC | 49.5 NANOSECONDS NOMINAL WRITE-CYCLE WIDTH |
| CZZZ | MEMORY CAPACITY | GB8 |
| PMLC | PRECIOUS MATERIAL AND LOCATION | 240 PIN DIMM USE GOLD CONTACT FINGERS GOLD |
| SUPP | SUPPLEMENTARY FEATURES | CL(IDD) = 9 CYCLES |
| TTQY | TERMINAL TYPE AND QUANTITY | 240 PIN |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 94.0 VOLTS MAXIMUM TOTAL |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| ESD | A - No known electrostatic discharge (esd) or electromagnetic interference (emi) sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | G - Item contains gold. |
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